Deep reactive ion etching (DRIE) is a highly anisotropic plasma etching process that creates deep, near-vertical features in silicon and related microfabrication materials. DRIE extends ordinary ...

Physicist Igor Kaganovich at the Department of Energy's (DOE) Princeton Plasma Physics Laboratory (PPPL) and collaborators have uncovered some of the physics that make possible the etching of silicon ...

The semiconductor industry is one of the most advanced and complex in the world. The semiconductor industry relies on highly ...

Researchers at Kanazawa University, in collaboration with Diamond and Carbon Applications (Germany), have developed a ...

After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor etching method that achieves etch rates up to five times faster than ...

Microneedle technologies have the potential for expanding the capabilities of wearable health monitoring from physiology to biochemistry. This paper presents the fabrication of silicon hollow ...

Using a combination of low-pressure oxygen and high temperatures, isotropic and anisotropic silicon (Si) etch rates can be controlled up to ten micron per minute. By varying the process conditions, we ...

Researchers in China have developed a three-step recycling process for end-of-life crystalline silicon PV modules that ...

For maximum resolution in a scanning tunneling microscope (STM), an extremely sharp metallic tip is required, which serves as the point through which the STM “scans” a sample. A blunt tip reduces STM ...

Development of next-generation power devices is needed for energy saving in a low carbon society. Diamond is a potentially important power device material due to its excellent physical and electronic ...

A team of physicists has uncovered some of the physics that make possible the etching of silicon computer chips, which power cell phones, computers, and a huge range of electronic devices. Physicist ...