ACM’s Ultra ECP ap-p enables next generation device performance amid accelerating market demand for advanced packaging ...

Copper electrodeposition is a vital process in the fabrication of microelectronic interconnects, battery components and decorative coatings. By utilising carefully formulated electrolytes and ...

Real-time monitoring of additive concentrations in acidic copper plating solution is critical for ensuring process stability and reliability in integrated circuit manufacturing. Traditional detection ...

Cyclic voltammetric stripping (CVS) analysis can be used to facilitate the detection of mercaptopropylsulfonic acid (MPS). MPS is the breakdown product of bis ...

The spacing between adjacent pads is too close to cause bridging, too far away will lead to false soldering. Unreasonable ...

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Researchers at Dartmouth College have developed a durable copper-based coating that can be precisely integrated into fabric to create responsive and reusable materials such as protective equipment, ...