Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...
Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...
As the Artificial Intelligence (AI) and High-Performance Computing (HPC) markets continue to rapidly grow, the semiconductor industry is racing to satisfy customer needs with advanced packaging ...
Semiconductor materials distributors are optimistic about operations in the second quarter of 2024, driven by rising semiconductor capacity and long-term demand for AI and High-Performance Computing ...
TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services and the #1 automotive OSAT, is innovating advanced packaging to ...
IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...
The semiconductor industry is preparing for the migration from proprietary chiplet-based systems to a more open chiplet ecosystem, in which chiplets fabricated by different companies of various ...
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ON Semiconductor shares rise after GaN partnership with GlobalFoundries
ON Semiconductor Corporation (NASDAQ:ON) shares advanced about 3% on Thursday after the company unveiled a strategic collaboration with GlobalFoundries (NYSE:GFS) to jointly develop and produce ...
The semiconductor process control equipment market offers opportunities driven by automation, AI, and sustainability priorities. Companies can benefit from investing in precision and efficient systems ...
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