ST. PAUL, Minn.--(BUSINESS WIRE)--3M, a leading supplier of advanced materials to the semiconductor packaging industry, today announced the opening of the company’s application laboratory in Yangmei, ...

Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...

A recent technical paper titled “Factors determining bond wave speed in wafer bonding” was published by researcher at Yokohama National University, Tokyo Electron Kyushu Limited and ANVOS Analytics.

This higher density of circuitry on a wafer requires greater accuracy and a highly fragile and advanced fabrication process. Several newer and highly complex ICs today are made of a dozen or more ...

Hybrid bonding has been in production for several years, with mature flows capable of delivering robust yields using 10µm interconnects. At that scale, processes can tolerate hundreds of nanometers of ...

When infrared technology wasn t enough, pulsed ultrasound found the cause of leaky MEMS tubes. An early and critical step in microelectromechanical system (MEMS) production is the bonding of two ...

Hybrid bonding is becoming more critical for advanced semiconductor packaging, thanks to its ability to enable high-density interconnects inside complex 3D assemblies. This approach involves the ...

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Dublin, Dec. 09, 2025 (GLOBE NEWSWIRE) -- The "Semiconductor Silicon Wafer Market" has been added to ResearchAndMarkets.com's offering. The global semiconductor silicon wafer market is poised for ...

Even though fifth-generation (5G) wireless technology has yet to fully take root around the world as the standard for mobile communications, researchers are already envisioning 6G wireless. This next ...