Level Validation Across Multiple Platforms to build a Robust 2.5D Multi Foundry Chiplet Solution” was published by ...

A new technical paper titled “Analyzing Collusion Threats in the Semiconductor Supply Chain” was published by researchers at ...

U.S. lifts EDA export restrictions to China; collusion risk in the IC supply chain; Onto buys materials analysis biz; ...

AI requires a lot of data, particularly for training models. The problem is that planar chips are unable to process all that ...

Researchers from MIT, Georgia Tech, and Air Force Research Laboratory propose a bonding process to integrate gallium nitride ...

A new technical paper titled “Patterned Multi-Wall Nanosheet FETs for Sustainable Scaling: Zero Gate Extension With Minimal ...

A new technical paper titled “Hardware-software co-exploration with racetrack memory based in-memory computing for CNN inference in embedded systems” was published by researchers at National ...

A Hybrid Approach for Efficient Hardware Security Verification” was published by researchers at RPTU Kaiserslautern-Landau and UC San Diego. “We propose FastPath, a hybrid verification methodology ...

The actual effect is transformative: cycle times that once stretched into weeks shrink to days. By combining the intelligent ...

AI drives workflow re-evaluation; DFT verification; hybrid control; managing AI coding agents; 3D-IC structural integrity.

A new technical paper (preprint) titled “Extreme Ultraviolet and Beyond Extreme Ultraviolet Lithography using Amorphous ...

A technical paper titled “Data-driven power modeling and monitoring via hardware performance counter tracking” was published ...