Chip-on-wafer-on-substrate (CoWoS) refers to the advanced packaging technology that offers the advantage of a larger package size and more I/O connections. It allows 2.5D and 3D stacking of components to enable homogenous and heterogenous integration.

Aug 8, 2024 · CoWoS-L is a back-end chip packaging method within the CoWoS platform that combines the advantages of CoWoS-S and InFO technologies. It uses an LSI chip interposer to provide the most flexible integration for chip-to-chip interconnection and RDL layer power and signal transmission.

CoWoS ®-L is one of the chip-last packages on the CoWoS ® (Chip on Wafer on Substrate) platform. It combines the merits of CoWoS ® -S and InFO (Integrated Fan-Out) technologies to provide the most flexible integration using an interposer with a Local Silicon Interconnect (LSI) chip for die-to-die interconnect and RDL layers for power and ...

Jan 16, 2025 · TSMC's CoWoS-S is a high-end 2.5D packaging technology that uses a silicon interposer to connect chiplets in a system-in-package. This technology has been...

CoWoS®-L For Heterogeneous Integration • Leverage InFO and CoWoS to integrate Si bridge, passives and RDL to best optimize CT, yield learning, system performance and EoS, etc.

Dec 21, 2024 · CoWoS-L, a chip-last packaging solution within TSMC's CoWoS® platform, designed for high-performance computing and advanced heterogeneous integration. CoWoS-L combines silicon interposer and fan-out technologies to …

Aug 25, 2020 · CoWoS-L is the new variant of TSMC’s chip-last packaging technology which adds in the Local Si Interconnect which is used in combination of a copper RDL to achieve higher bandwidth than just...

Jan 18, 2025 · CoWoS-L (Chip-on-Wafer-on-Substrate with Local Silicon Interconnect) represents a significant advancement over CoWoS-S in terms of performance and efficiency for high-end computing applications ...

Jan 20, 2025 · Figure 1 CoWoS-L marks a significant advancement over CoWoS-S in terms of performance and efficiency for AI and HPC applications. Source: TSMC. Huang also told Taiwanese reporters that Nvidia is still producing Blackwell’s predecessor, Hopper, using TSMC’s CoWoS-S advanced packaging technology. “It’s not about reducing capacity.

In this paper, we introduce CoWoS-L, a new architecture in the CoWoS family, to address the large Si interposer defect-driven yield loss concern.